1st Edition
Lead-Free Soldering in Electronics Science, Technology, and Environmental Impact
By Katsuaki Suganuma
Copyright 2004
376 Pages
by
CRC Press
Also available as eBook on:
Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties, plating and processing technologies, and evaluation methods vital to the production of lead-free solders in electronics. Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses soldering inspection and design, mechanical evaluation in electronics, lead-free solder paste and reflow soldering, plating lead-free soldering in electronics, and wave soldering.
Introduction to Lead-Free Soldering Technology. Materials Science Concepts in Lead-Free Soldering. Alloy Selections. Plating Lead-Free Soldering in Electronics. Tin Whisker Discovery and Research. Mechanical Evaluation in Electronics. Electrochemical Migration. Lead-Free Solder Paste and Reflow Soldering. Wave Soldering. Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection. Future of Lead-Free Soldering. Index.
Biography
Suganuma, Katsuaki